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Electroless Deposition for Advanced Packaging & Plating Applications
The semiconductor industry’s standardization of copper interconnect technology continues to represent significant investments in plating technology. Our electroless deposition chemical delivery systems are the industry’s leading solution to support this growing market.
Foresight’s wet chemical delivery product line is a turnkey solution for advanced plating and 3D packaging. Our systems connect and interface directly with advanced wafer plating tools and the fab’s bulk chemical delivery system, supporting reliable integration into existing chemical distribution systems. We have delivered thousands of systems that are installed in semiconductor fabs around the world.
Foresight owns the design and intellectual property, performs field upgrades, addresses obsolescence, maintains configuration control, and delivers production systems with our in-house engineers. These product lines are sold by leading OEMs or directly to fabs.
How CuSuite Wet Chemical Delivery Systems Ensure Consistent Electroless Deposition
Our CuSuite systems offer a complete multi-process tool delivery system that reflects proven semiconductor chemical delivery design and is controlled via a built-in central monitoring unit that automatically responds to the needs of up to four process tools. Designed for consistent, contaminant-controlled performance aligned with ultrapure chemical delivery system expectations, the CuSuite’s industry-leading uptime of over 99% allows engineers to focus on plating wafers, rather than solution delivery.
Centralized Control with the Master Delivery Unit (MDU)[
The master delivery unit (MDU) is central to system performance, as it enables integration into a single, centrally monitored control point and serves as the delivery point for the process tool. In many customer configurations, the MDU functions as a Chemical Delivery System (CDS) control hub, coordinating up to three satellite delivery units (SDUs) and two 200L drum chemical delivery units (CDUs), which can be deployed as a Chemical Delivery Module (CDM) architecture. The MDU uses a color touch screen to display the operations and status of the entire system graphically. Typically, the MDU is installed near the plating tools for convenient operator access and auto-configures to all CuSuite systems.
Precision Flow and Pressure Control
As a chemical delivery tool, the MDU provides a constant flow of plating solution at a consistent pressure through its onboard pressure vessel. When the MDU is networked to the CDU, the pressure vessel is automatically filled from the CDU, allowing the MDU to provide a smooth, even flow of plating solution to the process tool when required. A 4.5-gallon pressure vessel offers additional capacity to the CDU in the unlikely event that the plating solution is unavailable. The small size of the MDU allows for installation close to the plating tool while occupying as little floor space as possible. Where solvent-based chemistries are used, a Solvent Delivery System (SDS) approach can be incorporated into the overall system strategy.
The MDU has extensive safety features, including automatic sensing for warning and shutdown. It is SEMI S2-0200 and S8 compliant and designed to meet the National Electric Code, National Fire Protection Association, and CE compliance.
Supporting Adjacent Chemical Infrastructure
In addition to electroless deposition delivery, customers often evaluate adjacent systems that impact overall process integrity, including:
- Chemical handling and storage solutions
- Bulk chemical distribution infrastructure
- CMP slurry delivery systems and pumps designed for contaminant-free operation
Foresight’s solutions are designed to integrate within this broader ecosystem, supporting end-to-end chemical management strategies in advanced semiconductor manufacturing.
